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So far artimar has created 54 blog entries.

Cree Opens Design Possibilities for Architectural Lighting with New CLQ6A LED

Cree Opens Design Possibilities for Architectural Lighting with New CLQ6A LED   DURHAM, N.C. -- Cree expands its leading family of Architectural Lighting Class LEDs with the new CLQ6A RGBW (red, green, blue and white) LED. The first individually addressable one-watt RGBW LED in its class, the CLQ6A LED unlocks new designs that [...]

By | August 3rd, 2017|Cree, Releases|

KEMET Continues to Expand its Industry-Leading High Voltage Multilayer Ceramic Capacitor Portfolio

KEMET Continues to Expand its Industry-Leading High Voltage Multilayer Ceramic Capacitor Portfolio GREENVILLE, S.C., July 27, 2017 (GLOBE NEWSWIRE) -- KEMET Corporation (NYSE:KEM), a leading global supplier of electronic components, today announced the expansion of its surface mount High Voltage Multilayer Ceramic Capacitorportfolio with the addition of the EIA 0603 case size (1608 metric) with C0G temperature characteristics. [...]

By | August 3rd, 2017|Kemet, Releases|

Dataforth Protecting Signal Lines Against Electromagnetic Interference

Dataforth Protecting Signal Lines Against Electromagnetic Interference In today’s dynamic industrial environments, electronic devices, signal and power wiring, and other electrical plant/process equipment often interact to create “noise” or electromagnetic interference (EMI) problems which can degrade critical measurement and control signals. Proper grounding and shielding techniques can help reduce or eliminate these [...]

By | August 3rd, 2017|Dataforth, Releases|

Microchip Create More Reliable and Cost-Effective LED Lighting Applications with Microchip’s Sequential Linear LED Driver

Microchip Create More Reliable and Cost-Effective LED Lighting Applications with Microchip’s Sequential Linear LED Driver CL88020 is a Next Generation Device Designed for Offline Lighting CHANDLER, Ariz., July 10, 2017 — A next-generation sequential linear LED driver for offline lighting applications is now available from Microchip Technology Inc. (NASDAQ: MCHP). The CL88020, [...]

By | August 3rd, 2017|Microchip, Releases|

Infineon OptiMOS™ Linear FET combines a low RDS(on) with a large Safe Operating Area

Infineon OptiMOS™ Linear FET combines a low RDS(on) with a large Safe Operating Area Munich, Germany – 25 July 2017 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches the OptiMOS™ Linear FET series. This new product family combines the state-of-the-art on-state resistance (RDS(on)) of a trench MOSFET with the wide [...]

By | August 3rd, 2017|Infineon, Releases|

Coilcraft New Wirewound Chip Inductors

New Wirewound Chip Inductors Provide the Highest Inductance in the Industry's Smallest Package Optimized for LTE Antenna matching Twice the Qfactor of thin-film multilayer technology Higher inductance valuesthan other 0201 inductors 0201 size– 0.58 × 0.46 × 0.45 mm high RoHS Compliant, halogen free. 260°C compatible. Matte tin over molybdenum-manganese   Cary, IL, USA [...]

By | August 3rd, 2017|Coilcraft, Releases|

Infineon module CIPOS

Intelligent power module CIPOS™ Mini integrates power factor correction May 9, 2017 | Market News Munich, Germany – 9 May 2017 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the new CIPOS™ Mini featuring power factor correction (PFC). The intelligent power module (IPM) combines a single switch boost PFC stage and a [...]

By | July 18th, 2017|Infineon, Releases|

Infineon TRENCHSTOP

Infineon TRENCHSTOP™ Advanced Isolation package for discrete IGBTs May 10, 2017 | Market News Munich, Germany – 10 May 2017 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the new package technology TRENCHSTOP™ Advanced Isolation. It is available for TRENCHSTOP and TRENCHSTOP Highspeed 3 IGBTs for best-in-class thermal performance and simpler manufacturing. [...]

By | July 18th, 2017|Infineon, Releases|

Infineon full-SiC-module

Infineon starts volume production of first full-SiC-module, announces additional devices for its CoolSiC™ family at PCIM May 16, 2017 | Market News Munich and Nuremberg, Germany – 16 May 2017 – Higher efficiency, increased power density, smaller footprints and reduced system costs: these are the main advantages of transistors based on silicon carbide (SiC). [...]

By | July 18th, 2017|Infineon, Releases|

High power density discrete IGBT in TO-247PLUS package

High power density discrete IGBT in TO-247PLUS package Jun 6, 2017 | Market News Munich, Germany – 6 June 2017 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its 1200 V discrete IGBT product portfolio by offering up to 75 A. The devices are co-packed with a full rated diode in a [...]

By | July 18th, 2017|Infineon, Releases|